Go hotter. Go faster. Go where others can't.
We developed AquaSys filaments to address key product-performance gaps in the market. All AquaSys materials are water-soluble filaments that enable safe, easy, accelerated disposal. AquaSys 120 empowers you to work with a wide array of build materials, including Nylon, PC, and PP, with the same support filament. And AquaSys 180 offers new opportunities for engineering thermoplastics — including PEEK and PEKK.
Which AquaSys water-soluble filament is right for you?
AquaSys® 120
A one-of-a-kind, water-soluble support filament that’s stable at higher temperatures and dissolves up to 6x faster than other support materials, like BVOH or PVA.
From $100
1.75mm and 2.85mm diameter
500g and 1kg spool
Chamber temperature: 80–120°C
Extruder temperature: 220–245°C
Build plate temperature: Up to RT–130°C
Compatible with several engineering thermoplastics, including: PLA, Polyamide, Carbon Fiber Filled Polyamide, ABS, TPU, PC and PP.
AquaSys® 180
A unique, water-soluble support filament that allows you to build using high-temperature, engineering-grade thermoplastics.
From $200
1.75mm and 2.85mm diameter
500g and 1kg spool
Chamber temperature: Up to 180°C
Extruder temperature: 230–300°C
Build plate temperature: Up to 60–180°C
Compatible with several engineering thermoplastics including: PEEK, PEKK, PEI, and PPSU.
AquaSys outperforms other support materials.
See how AquaSys filaments compare to PVA, BVOH, and other commonly used support methods.
| AquaSys 120 | AquaSys 180 | Breakaway | PVA/BVOH | Chemical-soluble | |
|---|---|---|---|---|---|
| Compatible with engineering-grade build materials |
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| Compatible with PEEK, PEKK, PEI, and PPSU |
— | — | — | ||
| Requires minimal post-processing |
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| Enables safe, simple disposal |
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| Stable at high temperatures |
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| Dissolves in just tap water* |
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| Supports complex geometries |
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*AquaSys 120 is 100% soluble, while AquaSys 180 contains approximately 20 wt% of an inert, non-hazardous, non-biodegradable component that should be collected and disposed of after dissolution.